MIRTEC, the Global Leader in Inspection Technology, announces that it
will highlight its 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive
OMNI-VISION® 3D Inspection Technology in Booth # 7-504 at the SMT/Hybrid/Packaging
2013 exhibition and conference, scheduled to take place April 16-18, 2013 at
the Messezentrum in Nuremberg, Germany.
Tuesday, March 26, 2013
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